Samsung S5K2L3SX CIS from Galaxy S9+ (Model SM-G965F/DS) ACMOS Essentials - Advanced Packaging

Product Code
ACE-1803-802
Release Date
31/05/2018
Availability
Published
Product Item Code
UNK-SM-G965F_Dual-Rear-Cam2_Wide
Device Manufacturer
Unknown
Device Type
Camera Module
Subscription
Packaging
Image Sensor
Channel
Advanced Packaging - Process
Image Sensor - Packaging
This report presents an Advanced CMOS Essentials Package Analysis on the Samsung dual rear-racing camera module, with 12 MP triple stacked back illuminated (BI) CMOS image sensor (CIS), extracted from a Samsung Galaxy S9+ smartphone with the model number SM-G965F/DS.
Packaging and PCB Analysis

Our packaging experts are looking across manufacturers and technologies

TechInsights explores the largest consumer electronics markets to find innovative & disruptive semiconductor packaging events. When a disruptive event occurs, we analyze and report on it.