Samsung Exynos 9110 Samsung Fan-Out Panel Level Packaging - Advanced Packaging Essentials

Product Code
ACE-1810-803
Release Date
28/01/2019
Availability
Published
Product Item Code
SAM-SM-R810
Device Manufacturer
Samsung
Device Type
Smartwatch
Subscription
Packaging
Channel
Advanced Packaging - Process
This is an Advanced Packaging Essentials (APE) summary document for the Exynos 9110 fan-out panel level package (FO-PLP) built using Samsung’s next generation of semiconductor packaging technology.
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